Semiconductor Engineering

High Performance, Multi-Chip Leadframe Package With Internal Connections

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
Business Wire

DNP Develops Lead Frame for Miniaturized, Highly Reliable Semiconductor Package QFN(Quad Flat Non-leaded)

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...
Electronic Design

Two Bucks Regulators and Two LDOs in Power Management ICs

Analog Devices, Inc. introduced the ADP5034 regulator/LDO, a highly integrated power management IC that combines two 3-MHz, high efficiency, 1.2-A step down regulators with two 300-mA LDO (low drop ...
Electronic Design

Dual-Axis MEMS Accelerometers In Tiny Cases Suit Consumer Uses

The ADXL320/321 family of ±0.5-g iMEMS accelerometers are dual-axis units housed in thin 4- by 4- by 1.45-mm plastic lead-frame chip-scale packages (LFCSPs). Featuring signal-conditioned outputs, the ...