Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way ...
Business Wire

Ecopia AI and Airbus Expand Partnership to Enable Global 3D Vector Mapping

TORONTO--(BUSINESS WIRE)--Today, Ecopia AI announced the expansion of its partnership with Airbus, pairing Ecopia’s large-scale 3D vector mapping technology with Airbus’ global satellite imaging ...
JSTOR Daily

Some Vector and Arithmetic Operations on Two-Dimensional Orientation Variates, with Applications to Geological Data

In part I we compare vector ($\bar{a}$) and arithmetic ($\bar{x}$) means of circular-type variates by showing how each changes with addition of one measurement (an) to (n - 1) measurements.
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Lam Research launches VECTOR TEOS 3D tool

TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence and high-performance computing applications.