Global PC shipments declined 21% YoY in 3Q 2026 as elevated memory and other component costs continued to push up PC prices ...

Cadence will provide AI-enabled design, simulation and engineering expertise to DOE laboratories working on advanced ...

Siemens expands agentic AI workflow for faster signoff-grade electrothermal analysis across complex 3D IC package designs.

Glass handling, PVD process limits and cost of ownership are key challenges as Von Ardenne develops deposition systems for ...

GlobalFoundries is integrating five Singapore fab control centers into one system, using AI for monitoring, predictive ...

The collaboration combines deep trench capacitor technology and silicon capacitor designs for advanced packaging in AI and ...

New NPU family targets edge and data centre inference, with higher compute density and improved energy efficiency.

Design Assistant automates architecture planning and component research, while engineers retain approval over design ...

AI inference and agentic services are expected to lift server CPU demand, with ARM-based processors projected to reach 30% ...

The competition will test embodied AI models through training, simulation and real-robot tasks at a Shanghai hackathon.

Aiza Nisnisan won the Philippine Hand Soldering Competition, earning the opportunity to represent the country in Malaysia in ...

Global electronic system design revenue increased as semiconductor IP, services and Asia-Pacific demand recorded double-digit ...