In gelatine-based bio-adhesive hydrogels, to improve the conductivity of smart injectable sealants, leading to more sensitive ...

Toshiba and Farnell have deepened their partnership, extending the availability of the companies’ semiconductor products in Japan. Engineers and designers now have improved access to Toshiba’s latest ...

Anritsu Corporation revealed a notable enhancement to its MT8000A Radio Communication Test Station, expanding the platform's 5G device measurement capabilities to include support for 5G NR NTN ...

The family takes a new approach to NVMe RAID by disaggregating the company's Smart Storage platform into separate software and hardware components. Employing its PCIe storage controllers as the ...

As data rates for USB4 and Thunderbolt interfaces exceed 10GHz, ESD protection must provide superior RF performance while effectively guarding sensitive ICs against ESD events and surge pulses, ...

Delinea has unveiled Delinea Iris AI, a powerful and practical AI engine built natively into the Delinea Platform. The solution is driving new platform capabilities, including real-time, ...

Following the recent launch of its Application Hub, SECO has announced a new set of AI apps, marking the beginning of regular additions planned for the coming months. Each application has been ...

Mouser Electronics, Inc., launches its new automation resource centre to supply engineers with the latest in industrial automation. Engineers specialising in this field can employ this hub to stay ...

"Security isn't just a feature – it's foundational to everything we develop," said Matt Johnson, president and CEO of Silicon Labs. "Being the first to achieve PSA Level 4 certification is a powerful ...

The Engineering Design Show (EDS) is back, and it's bigger, bolder, and more essential than ever. As the UK’s flagship event ...

Designed for harsh environments, the 883M Digital Triaxial MEMS Accelerometer features an IP67 rating and an operating temperature range of -20C to +70C. The outputs align with ISO 10816-3 and ISO ...

KIOXIA Europe has begun sampling new Universal Flash Storage (UFS) Ver. 4.1 embedded memory devices designed for automotive applications. Engineered to satisfy the rigorous demands of next-generation ...