Abstract: Eutectic tin-bismuth solder has been identified in an iNEMI (International Electronics Manufacturing Initiative) roadmap as the solder of choice for 2nd level electronic packaging because of ...
Abstract: Near-eutectic tin-bismuth alloy is a strong contender as the solder of choice for low-temperature electronic assembly applications. This paper will describe the recent significant ...
Tin, an almost forgotten critical metal, is following a record-setting trail blazed this week by silver as it rises towards an all-time price high of $50,000 a ton. Like silver, which is selling for ...
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