Abstract: Flexible capacitive pressure sensors have gained significant attention in flexible electronics, offering extensive material and design options for various active sensing needs. Despite ...
Abstract: This paper presents the process of fabricating pressure sensor chip based on N-type 4H-SiC with high doping and realizing leadless packaging. The piezoresistive functional layer of the ...
Key Laboratory of Microsystems and Microstructure Manufacturing, Ministry of Education, Harbin Institute of Technology, Harbin 150080, China ...
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