The company has unveiled Redwood, an AI accelerator that it says was designed, verified and deployed on an FPGA in less than two weeks, starting from a specification written by two human architects.

The semiconductor industry’s race to add capacity will continue as AI and other advanced technologies increase chip demand. But adding capacity is only part of the equation. The goal is not simply to ...

A technical look at how lubricant chemistry, outgassing behavior, and particulate control influence semiconductor tool performance. Semiconductor manufacturing environments are engineered around ...

Available is the door being open. In control is whether it is safe to walk through: whether you can trust the tool to do to the next thousand wafers what it did to the last, stable and predictable, ...

Infineon Technologies will showcase customer cases, system solutions, and semiconductor innovations for Physical AI across robotics and mobility, intelligent edge devices as well as the infrastructure ...

Teradyne has launched the UltraFLEXplus S series, an extension of its UltraFLEXplus platform engineered to maximize output per square meter and operational efficiency for high-mix, variable-volume ...

A new high‑precision XY air bearing stage for step‑and‑scan semIconductor applications.

Applied Materials has unveiled its Equipment and Process Innovation and Commercialization (EPIC) Center, a $5 billion capital investment* to build the world’s largest facility dedicated to ...

The two-year-old company has working first silicon and new backing from Ibex Investors, OpenOcean and Quantum Systems co-CEO Florian Seibel.

At SEMICON West, Festo featured a range of solutions based on Controlled Pneumatics, a new generation of digital-pneumatic valve technology that advances pressure, flow, and motion regulation to ...

This year, engineering technologies business, Renishaw, is celebrating the 15th anniversary of the purchase of its Miskin site in South Wales, and the completion of the first phase of a further £70 ...

Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies.